Principal PIC Process Engineer
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Responsibilities
- Process Development & Integration
- Lead the design, development, and optimization of InP PIC and laser fabrication processes for high‐volume manufacturing
- Design and specify epitaxial layer structures in collaboration with device designers and epitaxy suppliers
- Develop complete fabrication process flows based on design requirements, tool capabilities, and manufacturing constraints
- Drive process integration, ensuring compatibility across metal, semiconductor, and dielectric modules
- Manufacturing Data & Yield Excellence
- Perform extensive data analysis of photonic device, wafer, and process data in a manufacturing environment
- Apply SPC, process capability analysis (Cp/Cpk), and statistical methods to monitor and improve process performance
- Lead or contribute to FMEA activities, root cause analysis, and corrective actions for yield and reliability issues
- Define and utilize metrology strategies to ensure robust process control
- Fab Execution & Cross‐Functional Collaboration
- Shepherd wafers successfully through the fab, coordinating closely with test, development, integration, and fabrication engineers
- Act as a senior technical interface with external or remote fabrication facilities, ensuring alignment on process execution and priorities
- Collaborate with device design, product engineering, and reliability teams to support technology readiness and product ramp
- Technical Leadership & Impact
- Provide technical leadership within the PIC process development domain
- Contribute to continuous improvement of tools, methods, and best practices
- Mentor junior engineers and support knowledge transfer across the broader team
- Process Development & Integration - Lead the design, development, and optimization of InP PIC and laser fabrication processes for high‐volume manufacturing - Design and specify epitaxial layer structures in collaboration with device designers and epitaxy suppliers - Develop complete fabrication process flows based on design requirements, tool capabilities, and manufacturing constraints - Drive process integration, ensuring compatibility across metal, semiconductor, and dielectric modules Manufacturing Data & Yield Excellence - Perform extensive data analysis of photonic device, wafer, and process data in a manufacturing environment - Apply SPC, process capability analysis (Cp/Cpk), and statistical methods to monitor and improve process performance - Lead or contribute to FMEA activities, root cause analysis, and corrective actions for yield and reliability issues - Define and utilize metrology strategies to ensure robust process control Fab Execution & Cross‐Functional Collaboration - Shepherd wafers successfully through the fab, coordinating closely with test, development, integration, and fabrication engineers - Act as a senior technical interface with external or remote fabrication facilities, ensuring alignment on process execution and priorities - Collaborate with device design, product engineering, and reliability teams to support technology readiness and product ramp Technical Leadership & Impact - Provide technical leadership within the PIC process development domain - Contribute to continuous improvement of tools, methods, and best practices - Mentor junior engineers and support knowledge transfer across the broader team
Qualifications
- Ph.D. in Electrical Engineering, Physics, or a related field
- Minimum 10 years of experience developing and characterizing materials and devices for optoelectronic applications
- Deep expertise in:
- PIC device physics
- Semiconductor, metal, and dielectric materials properties, characterization methods, and data interpretation
- Opto‐electronic testing of PIC devices
- Modeling, simulation, scripting, and working with large, complex data sets
- Physics‐based and data‐driven root cause analysis
- Demonstrated ability to drive cross‐functional engineering teams to measurable outcomes
- Excellent communication and organizational skills
- Preferred Qualifications
- Experience supporting technology transfer to high‐volume manufacturing
- Familiarity with yield ramp, qualification, and reliability testing for photonic devices
- Strong communication skills with the ability to translate complex technical issues across disciplines
- Experience working in foundry or captive fab environments supporting compound semiconductor technologies
- - Ph.D. in Electrical Engineering, Physics, or a related field - Minimum 10 years of experience developing and characterizing materials and devices for optoelectronic applications - Deep expertise in: - PIC device physics - Semiconductor, metal, and dielectric materials properties, characterization methods, and data interpretation - Opto‐electronic testing of PIC devices - Modeling, simulation, scripting, and working with large, complex data sets - Physics‐based and data‐driven root cause analysis - Demonstrated ability to drive cross‐functional engineering teams to measurable outcomes - Excellent communication and organizational skills Preferred Qualifications - Experience supporting technology transfer to high‐volume manufacturing - Familiarity with yield ramp, qualification, and reliability testing for photonic devices - Strong communication skills with the ability to translate complex technical issues across disciplines - Experience working in foundry or captive fab environments supporting compound semiconductor technologies
About Nokia
Nokia is a Finnish multinational technology company specializing in telecommunications infrastructure, software, and licensing. It provides network equipment and services for mobile, fixed, and cloud networks to communications service providers and enterprises worldwide.
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