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Principal PIC Process Engineer

Nokia
USA
Full-time
Senior · 10+ years experience
Onsite
Discovered 2 weeks ago
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Responsibilities

  • Process Development & Integration
  • Lead the design, development, and optimization of InP PIC and laser fabrication processes for high‐volume manufacturing
  • Design and specify epitaxial layer structures in collaboration with device designers and epitaxy suppliers
  • Develop complete fabrication process flows based on design requirements, tool capabilities, and manufacturing constraints
  • Drive process integration, ensuring compatibility across metal, semiconductor, and dielectric modules
  • Manufacturing Data & Yield Excellence
  • Perform extensive data analysis of photonic device, wafer, and process data in a manufacturing environment
  • Apply SPC, process capability analysis (Cp/Cpk), and statistical methods to monitor and improve process performance
  • Lead or contribute to FMEA activities, root cause analysis, and corrective actions for yield and reliability issues
  • Define and utilize metrology strategies to ensure robust process control
  • Fab Execution & Cross‐Functional Collaboration
  • Shepherd wafers successfully through the fab, coordinating closely with test, development, integration, and fabrication engineers
  • Act as a senior technical interface with external or remote fabrication facilities, ensuring alignment on process execution and priorities
  • Collaborate with device design, product engineering, and reliability teams to support technology readiness and product ramp
  • Technical Leadership & Impact
  • Provide technical leadership within the PIC process development domain
  • Contribute to continuous improvement of tools, methods, and best practices
  • Mentor junior engineers and support knowledge transfer across the broader team
  • Process Development & Integration - Lead the design, development, and optimization of InP PIC and laser fabrication processes for high‐volume manufacturing - Design and specify epitaxial layer structures in collaboration with device designers and epitaxy suppliers - Develop complete fabrication process flows based on design requirements, tool capabilities, and manufacturing constraints - Drive process integration, ensuring compatibility across metal, semiconductor, and dielectric modules Manufacturing Data & Yield Excellence - Perform extensive data analysis of photonic device, wafer, and process data in a manufacturing environment - Apply SPC, process capability analysis (Cp/Cpk), and statistical methods to monitor and improve process performance - Lead or contribute to FMEA activities, root cause analysis, and corrective actions for yield and reliability issues - Define and utilize metrology strategies to ensure robust process control Fab Execution & Cross‐Functional Collaboration - Shepherd wafers successfully through the fab, coordinating closely with test, development, integration, and fabrication engineers - Act as a senior technical interface with external or remote fabrication facilities, ensuring alignment on process execution and priorities - Collaborate with device design, product engineering, and reliability teams to support technology readiness and product ramp Technical Leadership & Impact - Provide technical leadership within the PIC process development domain - Contribute to continuous improvement of tools, methods, and best practices - Mentor junior engineers and support knowledge transfer across the broader team

Qualifications

  • Ph.D. in Electrical Engineering, Physics, or a related field
  • Minimum 10 years of experience developing and characterizing materials and devices for optoelectronic applications
  • Deep expertise in:
  • PIC device physics
  • Semiconductor, metal, and dielectric materials properties, characterization methods, and data interpretation
  • Opto‐electronic testing of PIC devices
  • Modeling, simulation, scripting, and working with large, complex data sets
  • Physics‐based and data‐driven root cause analysis
  • Demonstrated ability to drive cross‐functional engineering teams to measurable outcomes
  • Excellent communication and organizational skills
  • Preferred Qualifications
  • Experience supporting technology transfer to high‐volume manufacturing
  • Familiarity with yield ramp, qualification, and reliability testing for photonic devices
  • Strong communication skills with the ability to translate complex technical issues across disciplines
  • Experience working in foundry or captive fab environments supporting compound semiconductor technologies
  • - Ph.D. in Electrical Engineering, Physics, or a related field - Minimum 10 years of experience developing and characterizing materials and devices for optoelectronic applications - Deep expertise in: - PIC device physics - Semiconductor, metal, and dielectric materials properties, characterization methods, and data interpretation - Opto‐electronic testing of PIC devices - Modeling, simulation, scripting, and working with large, complex data sets - Physics‐based and data‐driven root cause analysis - Demonstrated ability to drive cross‐functional engineering teams to measurable outcomes - Excellent communication and organizational skills Preferred Qualifications - Experience supporting technology transfer to high‐volume manufacturing - Familiarity with yield ramp, qualification, and reliability testing for photonic devices - Strong communication skills with the ability to translate complex technical issues across disciplines - Experience working in foundry or captive fab environments supporting compound semiconductor technologies

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