Principal Hardware Manager

Why join our Dallas R&D team? • Work on next generation residential gateways and Wi Fi technologies deployed worldwide • Be part of a global R&D organization with strong local ownership and decision-making • Collaborate with hardware, RF, software, mechanical, and chipset partners • See your designs go from concept to mass production • Thrive in a fast paced, innovative, and multicultural environment

We are seeking a highly experienced Principal Hardware Manager to lead the definition, architecture, and development of next-generation residential broadband products. In this strategic leadership role, you will drive hardware innovation, guide technical direction, and manage high-performing engineering teams delivering cutting-edge connectivity solutions.

As a key member of the R&D leadership team, you will own the end-to-end hardware strategy and architecture of broadband products, from early technology scouting to product industrialization. You will lead cross-functional teams, drive innovation, and ensure alignment between technical execution and business objectives.

Your responsibilities will include:

Product Strategy & Technology Leadership • Lead technology scouting and maintain a strong technology watch on broadband silicon and wireless trends (Wi-Fi evolution, coexistence, power efficiency, performance optimization). • Define and drive chipset and platform selection (SoC, Wi-Fi, connectivity, memory, power management) based on performance, cost, lifecycle, and roadmap alignment. • Co-define product specifications with Product Management, ensuring alignment with market needs, standards, and customer requirements. Act as a technical leader in innovation, driving differentiation and new product concepts. • Partner with Procurement to evaluate cost structures, sourcing risks, and long-term component availability. System & Hardware Architecture • Own and define system and hardware architecture across broadband product lines, ensuring scalability and reuse across generations. • Lead high-level hardware design activities, including: ◦ PCB partitioning and functional allocation across one or multiple boards ◦ System block diagrams and pre-placement definition ◦ Mechanical form factor alignment with market and customer expectations • Collaborate closely with RF and mechanical teams to ensure optimal integration and performance. • Ensure architectural decisions consider: ◦ EMC/EMI and RF constraints ◦ Thermal and mechanical integration ◦ Manufacturability and cost (Design-to-Cost) • Drive early BOM estimation and product cost analysis in collaboration with Procurement.