Principal Engineer, Router Architect

Responsibilities

• Automotive Ethernet Routing : Architect L2/L3 switch fabrics supporting Time-Sensitive Networking (TSN) standards (e.g., IEEE 802.1AS, 802.1Qbv, 802.1Qbu) to ensure deterministic latency for safety-critical traffic.
• PCIe Backbone Architecture : Define PCIe Gen 5/6 integration for high-speed chip-to-chip connectivity between SoCs, AI accelerators, and storage, including support for SR-IOV to virtualize resources across multiple Virtual Machines (VMs).
• Functional Safety (ASIL) : Integrate hardware safety mechanisms (ECC, Parity, BIST, and End-to-End protection) to meet ASIL-B/D requirements within the routing engine and bus fabrics.
• Zonal Interconnect & Bus Fabric : Design the interface between Ethernet/PCIe controllers and internal NoC/CHI fabrics , ensuring efficient data movement for ADAS sensors (Camera, LiDAR) and telemetry.
• Virtualization & Security : Architect hardware-assisted isolation and Secure On-board Communication (SecOC) to protect the vehicle network from cyber threats while allowing shared access to network resources.
• Infrastructure & Power : Define robust clock, reset, and power management schemes capable of operating under automotive thermal profiles and supporting rapid "Instant-On" boot requirements
• Education: Bachelor’s or Master’s in Electrical Engineering or Computer Engineering (PhD desirable)
• Experience : 12+ years in high-speed networking or SoC architecture, with at least 5 years focused on Automotive-grade silicon.
• TSN Mastery : Deep expertise in IEEE 802.1 TSN protocols and their hardware implementation for real-time traffic shaping and synchronization.
• Protocol Expertise : Expert knowledge of PCIe (Root Complex/Endpoint) and Automotive Ethernet (10BASE-T1S to 10G+ levels) .
• Automotive Standards : Familiarity with ISO 26262 functional safety flows and AEC-Q100 reliability requirements.
• System Integration : Proven track record of integrating routing engines into complex SoCs using AXI/CHI bus protocols and managing IOMMU configurations.
• Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
• At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
• We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
• Are you ready to join our team and shape the future with us?
• Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement .
• Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.