Principal Engineer, Electrical Engineering – Advanced Packaging

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The Principal Electrical Engineer is a technical leader responsible for defining, designing, and governing the electrical architecture of advanced semiconductor packaging equipment (etch, deposition, etc.).

This role drives system-level electrical design excellence, ensures compliance with industry standards, and partners closely with systems, mechanical, process, and manufacturing teams to deliver robust, scalable, and high-performance tools.

• Define and own the electrical system architecture for advanced packaging semiconductor tools, including power distribution, grounding, EMC/EMI, controls, and safety systems.
• Develop and decompose electrical requirements for subsystems such as RF power delivery, motion control, sensors, PLC/safety systems, and mixed-signal electronics.
• Lead system and electrical design reviews (SRR, PDR, CDR).
• Ensure compliance with SEMI standards, CE/UL, EMC, and safety regulations.
• Collaborate with systems engineering to align architecture and requirements.
• Partner with process engineering to correlate electrical behavior with wafer performance.
• Lead root cause analysis of electrical and electromechanical issues.
• Drive DFMEA/FMEA, reliability analysis, and risk mitigation.