Plating Operator- Cuposit (Swing Shift)

The Electroless Cuposit Operator plays a key role in the application and maintenance of the Electroless Cuposit process, a specialized chemical plating method used to deposit a uniform, conductive copper layer on non-conductive surfaces in printed circuit board (PCB) manufacturing.

This process is essential for forming interconnects through vias and drilled holes prior to electrolytic copper plating.

This position is responsible for preparing panels, managing the chemical bath parameters, analyzing process performance, and ensuring the Electroless Cuposit process meets production, quality, and reliability standards.

To perform this job successfully, an individual must have a minimum of four (4) years’ in the printed circuit board industry and must be able to perform each essential duty satisfactory.

The requirements listed below are representative of the knowledge, skill and/or ability required.

• Operate and monitor the electroless copper plating line according to process specifications and safety protocols.
• Prepare and load PCB panels into cuposit racks.
• Handle and prepare chemical solutions safely and accurately.
• Inspect boards for defects or process issues before and after electroless plating.
• Clean and maintain equipment, tanks, and work areas in accordance with safety and quality standards.
• Coordinate with Quality Assurance to ensure product conformance to specification.
• Report equipment malfunctions or process deviations to maintenance or supervision.
• Follow all environmental, health, and safety regulations including proper handling and disposal of hazardous materials.

• Basic understanding of chemistry and plating processes preferred.