Packaging Architect

Ph.D. or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field.

15+ years of experience in advanced (2D/3D) packaging technologies, with exposure to optical packaging.

10+ years of deep expertise in one or more of the following domains: power/signal integrity, thermal-mechanical analysis, or optical packaging.

Demonstrated ability to perform system-level trade-offs across silicon, package, and board to define packaging technology solutions for complex products.

Extensive experience with high-speed interfaces including SERDES, PCIe, and die-to-die (D2D) interconnects, and their implications for substrate selection, interconnect architecture, signal integrity, and thermal management.

Proven track record of delivering successful packages and products from concept through production release.

Proficiency with industry-standard EDA and CAD tools.

Strong communication and collaboration skills, with experience working across engineering, supply chain, and external supplier organizations.

Technical leadership experience managing complex, multi-disciplinary projects under demanding technical and schedule constraints.

Ability to operate independently, drive decisions with minimal supervision, and manage ambiguity effectively.

Creative problem-solver with a track record of finding practical solutions under pressure.

We offer competitive compensation. The base salary range for this role determined based on location, experience, educational background, and market data.