Package Development/NPI Engineer

Main Requirements and Qualifications

• Solid hands-on experience (8+ years) in package development, NPI, and packaging assembly engineering, driving products from early development to HVM/MP in semiconductor industry.
• Technical expertise in advanced packaging technologies such as EMIB, 2.5D/3D/3.5D, FCBGA, HBM integration, and related interconnect technologies.
• Comprehensive understanding in qualification, reliability, and failure analysis methodologies for advanced packaging.
• Experience with yield improvement and production support in a manufacturing environment.
• Proven project management abilities in cross-functional and cross-regional environments.
• Effective communicator, able to interface with internal teams, suppliers and customers.
• About 25-40% international travel required.
• Location can be in San Jose, or Chandler AZ.
• Salary range: $180,000- $301,000
• Employee may be eligible for performance bonus, short and long term incentive programs. Actual total compensation will be dependent upon the individual's skills, experience and qualifications. In addition, MediaTek provides a variety of benefits including comprehensive health insurance coverage, life and disability insurance, savings plan, Company paid holidays, Sick Leave, Vacation time, Parental leave, 401K and more.
• MediaTek is an Equal Opportunity Employer that is committed to inclusion and diversity to all, regardless of age, ancestry, color, disability (mental and physical), exercising the right to family care and medical leave, gender, gender expression, gender identity, genetic information, marital status, medical condition, military or veteran status, national origin, political affiliation, race, religious creed, sex (includes pregnancy, childbirth, breastfeeding and related medical conditions), and sexual orientation.
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