Package Design Engineer

Responsibilities

• Develop physical package substrate design of large form-factor package for ML high-performance computers (HPCs).
• Develop and implement the methodology and CAD flow for efficient substrate design and enhanced productivity.
• Manage and drive co-design initiatives across chip, package, and system levels, including securing production sign-off for package designs.
• Collaborate closely with signal integrity/power integrity (SI/PI), thermal, and mechanical engineering teams to refine and optimize product package designs, test vehicles, and mock-up designs for product feasibility.
• Define and document the requirements for the package substrate design and bill of materials (BOM).
• - Develop physical package substrate design of large form-factor package for ML high-performance computers (HPCs). - Develop and implement the methodology and CAD flow for efficient substrate design and enhanced productivity. - Manage and drive co-design initiatives across chip, package, and system levels, including securing production sign-off for package designs. - Collaborate closely with signal integrity/power integrity (SI/PI), thermal, and mechanical engineering teams to refine and optimize product package designs, test vehicles, and mock-up designs for product feasibility. - Define and document the requirements for the package substrate design and bill of materials (BOM).

Minimum qualifications:

Preferred qualifications: