Optical Packaging Engineer

Qualifications

• You have:
• 2-4 years of experience.
• Experience in high-speed electronics package design and laser package design.
• Experience with optical coupling, fiber pigtail attachment, free space optics.
• Experience in microelectronics, optoelectronics packaging design and assembly.
• Knowledgeable in packaging technologies and processes, with glass/ceramic/metal material properties and multilayer materials interfaces after bonding.
• Hand-on experience with automated alignment tools, fiber optics, epoxy dispensation, optical measurement and metrology.
• Experience with documentation of fabrication, inspection, and assembly processes.
• Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
• Experience with package and process design/development from design to production.
• It would be nice if you also had:
• Knowledgeable in materials property and process, yield analysis and enhancement, failure mode and analysis, quality tools, such as DOE, SPC, and Six-Sigma process and analysis; Familiar with Industry Test Standards, such as JEDEC, EIA, Telcordia, Mil-Std, etc.
• Expertise in high-volume packaging of 2.5/ 3D packages.
• Knowledge of material properties and associated mechanical part fabrication processes.
• Familiar with flip chip, BGA, PCBA, flex design reliability and processing.
• Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience.
• You have: - 2-4 years of experience. - Experience in high-speed electronics package design and laser package design. - Experience with optical coupling, fiber pigtail attachment, free space optics. - Experience in microelectronics, optoelectronics packaging design and assembly. - Knowledgeable in packaging technologies and processes, with glass/ceramic/metal material properties and multilayer materials interfaces after bonding. - Hand-on experience with automated alignment tools, fiber optics, epoxy dispensation, optical measurement and metrology. - Experience with documentation of fabrication, inspection, and assembly processes. - Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively. - Experience with package and process design/development from design to production. It would be nice if you also had: - Knowledgeable in materials property and process, yield analysis and enhancement, failure mode and analysis, quality tools, such as DOE, SPC, and Six-Sigma process and analysis; Familiar with Industry Test Standards, such as JEDEC, EIA, Telcordia, Mil-Std, etc. - Expertise in high-volume packaging of 2.5/ 3D packages. - Knowledge of material properties and associated mechanical part fabrication processes. - Familiar with flip chip, BGA, PCBA, flex design reliability and processing. - Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience.