Mechanical Engineer

Cornelis Networks is hiring a talented Mechanical Engineer with experience in system and printed circuit board (PCB) assembly mechanical design.

The mechanical engineer will be involved in all phases of mechanical architecture and hardware development for high-performance electronics, focusing primarily on the next-generation Cornelis Networks Fabric platforms (adapters and switches).

The ability to effectively focus a significant amount of computational power on solving critical problems through the use of artificial intelligence, data analytics, and modeling/simulation techniques is vital to many scientific, commercial, and government organizations, and it is the mission of Cornelis Networks to deliver innovative purpose-built interconnect solutions that enable our customers to optimally apply vast computational resources to solve the world’s toughest problems.

Key tasks include:

• Mechanical Design & Architecture: Lead the mechanical design of high-performance interconnect products including PCIe adapters, networking switches, and complex electronic assemblies.
• NPI & Mass Production: Drive products through the complete NPI lifecycle, from early architecture and EVT/DVT validation to tooling release and high-volume mass production (MP).
• Manufacturing & DFM: Apply deep expertise in manufacturing processes—specifically die casting, sheet metal fabrication, and extrusion—to ensure designs are optimized for mass production, cost, and reliability.
• CAD & PLM Ownership: Create, maintain , and manage 3D models, 2D drawings, and BOMs using PTC Creo and Windchill (or similar enterprise CAD/PLM tools).
• Cross-Functional Collaboration: Partner closely with thermal, electrical , regulatory , and manufacturing teams to manage trade-offs involving mechanical envelopes, structural integrity, and thermal constraints.
• Prototyping & Lab Testing: Drive physical prototyping, tolerance stack-up analysis, and mechanical qualification testing (e.g., shock, vibration, environmental) in the lab.

Minimum qualifications

• BS in Mechanical Engineering or a closely related field.
• 5+ years of experience in the mechanical design of electronics packaging, adapters, or networking hardware.
• Strong expertise in standard datacenter form factors (PCIe, OCP 3.0, EIA-310) and rack-level mechanical integration.
• Deep understanding of volume manufacturing processes including die casting, sheet metal, and extrusion.