Mechanical Engineer 2

Company: Mattson Technology, Inc., a 38-year Silicon Valley company, designs, manufactures, markets, and globally supports plasma and rapid thermal processing equipment to fabricate integrated circuits for the global semiconductor industry.

Mattson Technology, Inc. offers processing equipment that utilizes innovative technologies to deliver advanced processing capabilities and high productivity for the fabrication of current and next-generation integrated circuits.

Our equipment and technologies are used by leading memory and logic, analog /power device manufacturers worldwide.

Innovations from Mattson Technology in Atomic Surface Engineering address the most critical logic and memory manufacturing challenges.

In May 2016, Mattson Technology was acquired by Beijing’s E-Town Capital.

Our new investor’s vision is that Mattson Technology, with its Silicon Valley DNA, will continue to operate as a global, market-driven technology provider serving worldwide semiconductor manufacturing customers.

In July, 2025, the company successfully listed in Shanghai’s STAR Exchange.

As the external trade compliance environment evolves, Mattson Technology now operates independently from the parent company in product, business, and operations, serving customers outside of China.

• Generate mechanical design concepts and feasibility studies for making proposals for CES/CIP/R&D project requests
• Conduct and participate in formal/informal design reviews to contribute and generate discussion/alternate ideas on various aspects of the design
• Specify, supervise, and perform engineering analysis of complex scope, in the following areas: Wafer transfer methods including robotics, friction, particle control, vacuum and end effectors, Mechanism design in assemblies such as slit valves, lift pins, indexers, Wafer temperature management (in both process and transfer environments) including cooling stations, pedestals, ESC
• May be responsible for the design, development and implementation of custom mechanical tooling, fixturing, and associated processes to enable the handling, assembly and/or disassembly of parts, components, sub-assemblies and final assemblies throughout the product life cycle.
• Responsible for design proposals, system design, solid models in 3D (parts and assemblies), 2D drawings, bills of material, submitting ECO’s, test specifications, test reports, functional specification and product specifications
• Manage communications and expectations with internal and external customers and vendors to ensure accomplishing project objectives
• Work intensely with SAP, Pro-E (Creo), Sharepoint and other software applications to properly manage and document projects
• Work hands-on when needed in the engineering lab and manufacturing to support the installation and test of CES/CIP designs that get delivered on customer systems
• Solve engineering problems using analytical techniques and engineering knowledge such as thermodynamics, heat transfer, measurement control, stress analysis, Finite Element Analysis, or system integration.
• Other duties as assigned

• Mechanism design capability compatible with semiconductor equipment
• Requires strong skills in change management, problem solving, communication skills, customer orientation, product technology, global business perspective, personal effectiveness, project management, team skills and quality
• Requires knowledge of systems and software necessary to perform job function, including ProEngineer WildFire, SAP, MS Word, Excel, PowerPoint, MS Project, Visio, AutoCad
• Ability to work under pressure to design cost effective solutions with serviceability and manufacturability
• Requires ability to influence other people; ability to act as a mentor, lead and/or supervise projects
• Must be able to work in a theoretical domain or hands on practical situation.
• General knowledge of electrical and software engineering disciplines
• BS in Mechanical Engineering and 3 or more years directly related experience, or equivalent.