Line Quality Technician (Jagiroad, AS, IN)

The Line Quality Technician operates within a semiconductor IC backend manufacturing and packaging environment and is responsible for in‑process and end‑of‑line quality control activities on the production line .

The role focuses on ensuring product quality across IC assembly, packaging, and singulation processes by performing inspections, identifying non‑conformances, and supporting corrective actions in real time.

• Perform in‑process and end‑of‑line quality control inspections at various stages of semiconductor packaging production.
• Execute inspections on the production line to identify defects and deviations from defined process and quality requirements.
• Follow established quality control procedures to detect product and process non‑conformances.
• Collaborate with cross‑functional teams (production, engineering, quality) to address and resolve quality issues promptly.
• Conduct statistical analysis and root cause analysis to identify defect trends and improvement opportunities.
• Monitor and evaluate line processes to ensure compliance with industry standards, customer requirements, and internal specifications.
• Implement and maintain quality documentation , including inspection results and control records.
• Work closely with production line teams to provide real‑time feedback and support continuous improvement initiatives.
• Conduct line audits to verify adherence to quality control protocols and procedures.
• Provide training and guidance to production personnel on quality control practices and inspection standards.
• Support cross‑functional collaboration to integrate quality controls into new product or package introductions .

• Bachelor’s degree or Diploma in Mechanical Engineering, Electrical Engineering, Materials Science , or a related field.
• Hands‑on experience with quality control tools (SPC, FMEA, MSA, 8D, 7QC tools).
• Minimum 3 years of relevant experience in the semiconductor industry , with exposure to:
• Plasma cleaning
• Plasma cleaning
• Molding
• Molding
• Laser marking
• Laser marking
• Saw / Punch singulation
• Saw / Punch singulation
• Plating and buffing
• Plating and buffing
• AOI
• AOI
• Pick & Place inspection
• Pick & Place inspection
• Experience performing Laser marking FAI , package dimension measurement , wettability checks , and AOI defect assessment .
• Strong knowledge of ISO 9001 and IATF 16949 standards.
• Familiarity with statistical tools such as JMP or Minitab.
• In‑depth knowledge of IC packaging and backend processes .