In-Process Inspector

OSI Systems companies have a long history of developing innovative solutions to bring a better quality of life to the world.

Healthcare, security, and defense are among the key markets where we have made significant inroads with new ideas, products, and processes.

We know that many people live in difficult and dangerous conditions.

To improve these circumstances, experts need simple, effective tools utilizing the latest in technology.

As a global company, we are dedicated to developing these tools for our customers and the people they serve worldwide.

Our singular focus is to help security experts, clinical professionals and high-tech developers solve real-world problems and issues.

Our OSI Electronics division is a diversified manufacturer of electronic devices and value-added manufacturing services for use in a broad range of applications, including aerospace and defense electronics, security and inspection systems, and medical monitoring and diagnostics.

OSI Electronics is seeking an In-Process Inspector to join their team.

This individual will perform inspection and verification activities throughout the electronics manufacturing process to ensure printed circuit board assemblies (PCBAs), subassemblies, and finished products meet customer requirements, production documentation, workmanship standards, and internal quality procedures.

They will also support product quality, traceability, and process compliance by inspecting assemblies after key manufacturing operations such as SMT placement, soldering, wire bonding, conformal coating, mechanical assembly, and electrical or functional testing.

• Perform in-process inspection and final inspections for PCBAs after soldering, bonding or conformal coating, mechanical operation, or testing per production traveler or router and customer BOM and drawings.
• Evaluate soldering workmanship on surface mount and through-hole assemblies using IPC-A-610 and/or J-STD-001 acceptance criteria, including inspection of solder joints, component placement, polarity, orientation, cleanliness, bridging, insufficient solder, lifted leads, damaged components, and other workmanship defects.
• Review and verify AOI verification and X-ray inspection of assemblies by reviewing automated inspection results, confirming defects, identifying false calls, documenting findings, and verifying hidden solder joints or internal conditions such as BGA solder quality, voiding, opens, shorts, misalignment, and other nonconformances.
• Conduct First Article Inspection or First Piece Inspection in accordance with the production traveler, customer drawing, BOM, approved sample, inspection checklist, and applicable acceptance criteria before authorizing continuation of production.