High-Speed Package Design Engineer
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About the Role
At Nokia Bell Labs, we invent the future of communications. Our research and development teams create technologies that power next-generation wireless, optical, and system-level platforms. We are seeking highly motivated engineers to contribute to advanced hardware innovation at the intersection of silicon, packaging, and systems.
Key Skills for This Role
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Responsibilities
- Lead the design and development of high-speed IC packages, including SiP, FC-BGA, and advanced heterogeneous integration solutions
- Define package architectures, stack-ups, routing strategies, and interconnect to meet SI/PI and RF requirements
- Perform 3D EM simulation and SI/PI analysis of package transitions, passive components, and die-to-package interfaces
- Co-optimize die, package, and PCB designs in collaboration with silicon, board, and system integration teams
- Correlate simulation results with laboratory measurements (e.g., VNA, TDR/TDT, high-speed oscilloscope)
- Contribute to the definition and evolution of package ADKs, reusable libraries, technology files, and verification flows, working in partnership with EDA vendors
- Provide technical input and design validation for vendor-supported automation and enablement efforts
- Support continuous improvement of package design methodologies and best practices across projects
- - Lead the design and development of high-speed IC packages, including SiP, FC-BGA, and advanced heterogeneous integration solutions - Define package architectures, stack-ups, routing strategies, and interconnect to meet SI/PI and RF requirements - Perform 3D EM simulation and SI/PI analysis of package transitions, passive components, and die-to-package interfaces - Co-optimize die, package, and PCB designs in collaboration with silicon, board, and system integration teams - Correlate simulation results with laboratory measurements (e.g., VNA, TDR/TDT, high-speed oscilloscope) - Contribute to the definition and evolution of package ADKs, reusable libraries, technology files, and verification flows, working in partnership with EDA vendors - Provide technical input and design validation for vendor-supported automation and enablement efforts - Support continuous improvement of package design methodologies and best practices across projects
Qualifications
- Required Qualifications
- MS or PhD in Electrical Engineering, Applied Physics, or equivalent relevant industry experience
- 5+ years of hands-on experience in IC package design for high-speed, RF, or mixed-signal applications
- Strong fundamentals in electromagnetics, signal integrity, and power integrity
- Experience with 3D EM and package design tools (e.g., HFSS, CST, ADS, Allegro X APD, Xpedition, or equivalent)
- Ability to work independently and collaboratively in a cross-functional, research-driven environment
- Preferred Qualifications
- Experience with advanced packaging technologies (chiplets, 2.5D/3D integration, interposers)
- Familiarity with ADKs, PDKs, or design enablement concepts, including collaboration with EDA vendors
- Working knowledge of Python and/or Tcl for design automation, simulation support, or data analysis
- PCB design and technology (e.g., Altium or equivalent)
- Required Qualifications - MS or PhD in Electrical Engineering, Applied Physics, or equivalent relevant industry experience - 5+ years of hands-on experience in IC package design for high-speed, RF, or mixed-signal applications - Strong fundamentals in electromagnetics, signal integrity, and power integrity - Experience with 3D EM and package design tools (e.g., HFSS, CST, ADS, Allegro X APD, Xpedition, or equivalent) - Ability to work independently and collaboratively in a cross-functional, research-driven environment Preferred Qualifications - Experience with advanced packaging technologies (chiplets, 2.5D/3D integration, interposers) - Familiarity with ADKs, PDKs, or design enablement concepts, including collaboration with EDA vendors - Working knowledge of Python and/or Tcl for design automation, simulation support, or data analysis - PCB design and technology (e.g., Altium or equivalent)
About Nokia
Nokia is a Finnish multinational technology company specializing in telecommunications infrastructure, software, and licensing. It provides network equipment and services for mobile, fixed, and cloud networks to communications service providers and enterprises worldwide.
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