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We are seeking a highly motivated Principal System Engineer to join our Application Engineering team and drive the successful deployment of next-generation Optical DSP and Active Electrical Cable (AEC) solutions for AI and cloud infrastructure.
The ideal candidate possesses deep expertise in communication theory, high-speed link modeling, DSP algorithms, IEEE Ethernet standards, and correlation between simulations and laboratory measurements.
General Summary:
As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. New Position
Minimum Qualifications:
We are seeking a highly motivated Principal System Engineer to join our Application Engineering team and drive the successful deployment of next-generation Optical DSP and Active Electrical Cable (AEC) solutions for AI and cloud infrastructure.
The ideal candidate possesses deep expertise in communication theory, high-speed link modeling, DSP algorithms, IEEE Ethernet standards, and correlation between simulations and laboratory measurements.
Lead system-level modeling and simulation of high-speed PAM4 communication links across optical and electrical channels.
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Develop end-to-end link performance models including: DSP transmitter and receiver architectures Optical transmitters and receivers Laser and photonic components Electrical channels Connectors and cable assemblies
DSP transmitter and receiver architectures
Optical transmitters and receivers
Laser and photonic components
Electrical channels
Connectors and cable assemblies
Evaluate next-generation Ethernet connectivity technologies for AI and cloud infrastructure applications.
Generate and maintain IBIS-AMI and related customer-facing models for product evaluation and system design activities.
Support customer simulations involving PCB channels, cables, connectors, packages, and optical links.
Collaborate with silicon, package, and system design teams to improve model accuracy and usability.
Serve as a subject matter expert for IEEE 802.3 Ethernet specifications and compliance methodologies.
Develop simulation and measurement methodologies aligned with IEEE standards.
Support product compliance activities for: CEI interfaces 100G/lane PAM4 200G/lane PAM4 Future 400G/lane technologies
CEI interfaces
100G/lane PAM4
200G/lane PAM4
Future 400G/lane technologies
Participate in interoperability activities and customer qualification efforts.
MS or PhD in Electrical Engineering, Applied Mathematics, Physics, Computer Engineering, or related field.
12+ years of experience in high-speed communications, optical networking, DSP, SerDes, or related technologies.
Deep expertise in system-level modeling and simulation of high-speed communication systems.
Strong understanding of optical communication systems and Ethernet interconnect technologies.
Expert knowledge of linear and nonlinear communication system theory.
Expert knowledge of PAM4 signaling and DSP-based communication systems.
Extensive experience developing models for electrical and optical components.
Strong understanding of IEEE 802.3 Ethernet standards and compliance methodologies.
Advanced MATLAB and/or Python programming skills for algorithm development, simulation, and automation.
Excellent written and verbal communication skills.
Verified company details for this employer are not available yet.
CAD 108800-158800 yearly / year
Full-time
Senior · 12+ years experience
Onsite
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