Firmware Engineer Lead

At Kandou , we are redefining the economics of AI infrastructure.

Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.

Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient .

Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.

Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.

We are actively seeking a Firmware Engineer Lead, based in Hyderabad OR Bangalore

• Work to develop, test and maintain embedded firmware for silicon products.
• Ensuring the robustness of code by implementing and running a software test suite
• Migration, consolidation and development of existing silicon debug software
• Software design and support for our silicon design infrastructure

• Strong experience in designing, coding and debugging real-time applications in C and/or C++ in a embedded environment
• Experience in using or implementing Real-Time scheduler or RTOS
• Knowledge of 32-bit processor architecture
• Interfacing to hardware and peripherals: SPI, I2C/SMBus, JTAG
• Debugging at application and hardware level
• Appreciation of Software validation and verification techniques
• Ability to develop under different platforms (Linux, Windows)
• Use of modern SW development workflows (CI/gitlab/makefile/CMake etc.)
• Independent, self starter who can help drive the firmware development forward.