Failure Analysis Engineer (Semiconductor / Electronics)

Qualifications

• BSEE is required
• Direct, hands-on Failure Analysis laboratory experience (semiconductor and electronics industry)
• Experience and knowledge in the following: Semiconductor, materials analysis, electronics manufacturing, design, etc.
• Experiences as a technical lead, manager or mentor are highly desired
• Required Hands-on experience/expertise: Root cause failure analysis Fault isolation techniques: OBIRCH, XIVA, emmi, IR Thermography Electrical Test/Measurements: ATE datalog, Curve trace, Bench test (parametric analyzer, o-scopes, CV measurement, LCR meter, etc.) Microprobing/Picoprobing X-ray (2D) SEM/EDS
• Root cause failure analysis
• Fault isolation techniques: OBIRCH, XIVA, emmi, IR Thermography
• Electrical Test/Measurements: ATE datalog, Curve trace, Bench test (parametric analyzer, o-scopes, CV measurement, LCR meter, etc.)
• Microprobing/Picoprobing
• X-ray (2D)
• SEM/EDS
• Highly desired Hands-on experience/expertise: LVP/LTP, SDL/LADA DBFIB, PFIB X-ray (CT/3D) Scanning Acoustic Microscopy (C-SAM). Deprocessing (RIE, parallel lapping, PFIB, etc.) Chemical etching (decapsulation, HF, acids/bases, delineation, etc.). Plasma etching (RIE, ICP, CF4, etc.) Cross sectioning (metallurgical, ion mill, DB FIB, etc.) Nanoprobing FinFET and advanced node technology DPA (Destructive Physical Analysis) Software: GDS layout, LabView
• LVP/LTP, SDL/LADA
• DBFIB, PFIB
• X-ray (CT/3D)
• Scanning Acoustic Microscopy (C-SAM).
• Deprocessing (RIE, parallel lapping, PFIB, etc.)
• Chemical etching (decapsulation, HF, acids/bases, delineation, etc.).
• Plasma etching (RIE, ICP, CF4, etc.)
• Cross sectioning (metallurgical, ion mill, DB FIB, etc.)
• Nanoprobing
• FinFET and advanced node technology
• DPA (Destructive Physical Analysis)
• Software: GDS layout, LabView
• Working knowledge of: Device physics, circuits/schematics, analog/digital circuits, IC design DPA, Mil-Std, AEC, JEDEC, IPC, etc. Semiconductor fabrication/process, yield enhancement Manufacturing, IC package assembly NPI, Reliability/Qualification testing
• Device physics, circuits/schematics, analog/digital circuits, IC design
• DPA, Mil-Std, AEC, JEDEC, IPC, etc.
• Semiconductor fabrication/process, yield enhancement
• Manufacturing, IC package assembly
• NPI, Reliability/Qualification testing
• Able to develop new methods or techniques
• Excellent English communication skills (written and spoken)
• A strong work ethic with a commitment to accuracy
• The ability to work to deadlines in a team-oriented environment are essential
• Must be able to remain in a stationary position up to 80% of the time.
• Ability to continuously operate a personal computer or lab equipment for extended periods of time (4 or more hours).
• Ability to operate a keyboard and other lab equipment, use a telephone, access file cabinets and other items stored at various levels, including overhead
• Ability to communicate clearly and understandably ensure an accurate exchange of information in normal conversational distance, over the telephone, and in a group setting.
• Ability to handle small and fragile devices with tweezers and /or fingers.
• Require close distance visual acuity with or without correction (Glasses, Contacts, etc.)
• Must be willing and able to wear PPE such as hard-hat, steel-toed shoes, safety glasses, laboratory coat and/or any other devices or equipment that is required.
• Learn new tasks, remember processes, maintain focus, complete tasks independently, make timely decisions in the context of a workflow, ability to communicate with visitors, ability to complete tasks in situations that have a speed or productivity quota.
• Ability to move equipment or items up to 50 lbs.