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Key skills for this role
Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
1 year of experience in a wafer level or die level cleanroom environment.
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1 year of experience with one or more of the following: SPC (statistical process control), Electrical test (Probing), Metrologies (SEM, XPS, Interferometry), or Failure analysis.
1 year of experience in hybridization techniques, including flip chip bonding, die handling and post bonding measurement.
Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).
Experience with developing novel bump materials, scaling up die sizes, flip-chip bonding or designing robust structural bonding solutions.
Experience with characterization techniques including SEM, XPS, confocal microscopy, and interferometry.
Experience with statistical process control and failure analysis activities.
Experience with data analysis and visualization tools such as JMP, Python, or SQL.
Technology company specializing in search, advertising, cloud computing, and AI
Visit company websiteJobs and hiring trendsUSD 108000-153000 / year
Junior · 1+ years experience
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