Engineering Manager -Data Center Thermal & Cooling

Role Overview

Leadership and Technical Direction

• Lead a team of 8–10 mechanical, thermal, and power-electronics engineers.
• Provide technical leadership, coaching, and strategic direction while championing Digital Engineering, Model-Based Design, DFSS, and technology-development processes.
• Define roadmaps for liquid cooling, direct-to-chip cooling, immersion cooling, CDU systems, power conversion, advanced controls, and related infrastructure.

Strategy and Commercialization

• Assess data-center market trends, customer needs, competitive landscapes, regulatory requirements, and emerging technologies.
• Translate market and technology insights into product roadmaps and innovation initiatives.
• Develop business cases, technology proposals, and commercialization strategies with internal and external stakeholders.

Program and Resource Management

• Lead advanced-engineering and NTI programs from concept through commercialization while managing risks and business milestones.
• Collaborate with global engineering, operations, sales, supply chain, and program-management teams.
• Own workforce planning, resource allocation, organizational capability development, engineering budgets, laboratory infrastructure, capital expenditures, and engineering tools.

Talent Development

• Develop hiring, engagement, succession, retention, and capability-development strategies aligned with data-center growth.
• Coach and mentor future leaders and foster continuous learning, professional growth, accountability, collaboration, and high performance.

Qualifications

• Master’s degree in mechanical or thermal engineering.
• Proven leadership in data-center cooling, thermal management, and technology development.
• 8–15 years of experience in a multinational environment working with OEMs, hyperscalers, and data-center customers.
• At least 3 years of engineering leadership experience managing multidisciplinary teams in thermal, cooling, power, or related technologies.
• Experience with North American or European stakeholders is preferred.
• Exposure to liquid cooling, direct-to-chip cooling, immersion cooling, CDU systems, and AI data-center infrastructure is preferred.

Leadership Skills

• Organizational and technical leadership development.
• Strategic agility, drive for results, motivation of others, managerial courage, powerful feedback, decision quality, and business acumen.