Engineering Lead, Global Instant Payments Platform - Senior Vice President

• Lead the architecture, design, and delivery of Citi's next-generation Instant Payments platform, providing hands-on technical leadership across the full Software Development Lifecycle (SDLC).
• Design and develop high-performance payment services using Java, distributed systems principles, and event-driven architectures to support low-latency, real-time transaction processing at global scale.
• Drive the modernization of payment platforms on AWS through cloud-native architectures, microservices, APIs, containerization, and automated infrastructure practices.
• Build and evolve payment capabilities supporting RTP, FedNow, UPI, SEPA Instant, and emerging real-time payment networks across multiple markets and regulatory jurisdictions.
• Architect highly resilient and scalable systems capable of processing millions of transactions daily with demanding requirements for latency, availability, security, and operational resilience.
• Lead and mentor a team of engineers while remaining actively engaged in technical design reviews, architecture decisions, code quality, and resolution of complex engineering challenges.
• Partner with Product, Operations, Sales, and business stakeholders to translate client and market requirements into innovative payment capabilities and platform enhancements.
• Build and enhance core payment platform services including payment orchestration, liquidity management, reconciliation, settlement processing, transaction monitoring, exception management, and recovery capabilities.
• Champion engineering excellence through automated testing, CI/CD, observability, performance engineering, secure software development practices, and measurable quality outcomes.
• Leverage AI-enabled software engineering tools throughout the SDLC to improve developer productivity, code quality, testing effectiveness, platform reliability, and delivery velocity.

• 12+ years of software engineering experience, including significant experience building large-scale payment processing, transaction processing, or financial technology platforms.
• Expert-level Java development experience with deep understanding of concurrency, JVM performance tuning, asynchronous processing, low-latency application design, and distributed systems engineering.
• Proven experience designing and delivering high-throughput, mission-critical systems operating at enterprise scale.
• 5+ years of hands-on AWS experience building, deploying, and operating cloud-native applications in production environments.
• Strong expertise in microservices, event-driven architectures, REST APIs, messaging systems, and streaming technologies such as Kafka.
• Deep understanding of instant payments, payment processing, settlement, reconciliation, liquidity management, transaction lifecycle management, and payment operations.
• Demonstrated experience leading engineering teams while maintaining hands-on involvement in architecture, technical design, and solution delivery.
• Strong experience with Agile delivery, automated testing, CI/CD pipelines, observability, and production support.
• Experience leveraging AI-powered engineering tools and modern software development practices to accelerate development and improve engineering productivity.
• Excellent communication and stakeholder management skills with the ability to influence technical and business decisions across a global organization.
• Experience developing or operating platforms supporting RTP, FedNow, UPI, SEPA Instant, Faster Payments, Visa Direct, Mastercard Send, or similar real-time payment networks.
• Knowledge of global payment regulations, operational resiliency requirements, and financial services risk controls.

Join a team shaping the future of global money movement and real-time payments.

You'll have the opportunity to build cloud-native payment infrastructure at global scale, solve complex low-latency distributed systems challenges, influence the evolution of instant payments worldwide, and leverage AI-powered engineering capabilities to deliver the next generation of payment innovation.

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