Perform board‑level bring‑up, functional and design verification testing on spacecraft power electronics boards.
Methodically troubleshoot issues using schematics, layouts, component data, and design intent.
Analyze anomalies and drive root‑cause identification (component failures, layout concerns, firmware interface issues, power sequencing errors, etc.).
Use bench instrumentation to validate power rails, heater drivers, analog front ends, digital interfaces, and protection circuits.
Execute tests in situations where procedures are evolving; develop and refine test steps as required.
Document findings clearly and provide actionable feedback to design engineering teams.
Support failure analysis, corrective actions, and re-testing as needed.
Collaborate with software, systems, manufacturing, and other functional teams to ensure design maturity and production readiness.
BS Degree in Electrical Engineering.
Minimum 8+ years of hands-on experience testing and troubleshooting complex electronic PCBs.
Proven ability to isolate and diagnose hardware issues down to component-level root cause.
Direct experience testing power electronics (e.g., DC/DC converters, power sequencing, protection circuits).
Strong familiarity with standard bench instrumentation (oscilloscopes, SMUs, electronic loads, DMMs, power analyzers).
Comfortable working onsite in a lab environment with flight hardware.
Experience working with SMPS, Load Switches, Op-Amps and Comparators.
Experience with FPGA, microcontroller, or microprocessor-based control and telemetry interfaces.
Ability to travel as needed, up to 10% on average.
Master’s degree in Electrical Engineering.
Strong proficiency interpreting and working directly from schematics and board layouts.
Ability to work with incomplete test documentation and adapt procedures during bring‑up.
Experience testing or bringing up spacecraft power modules (PCU, PDU, BMS/BCPM, heater drivers) or similar flight‑class power systems.
Demonstrated expertise troubleshooting high‑reliability power electronics, including nuanced failure modes (e.g., control‑loop instability, sequencing transients, marginal component derating).
Experience diagnosing complex mixed-signal interactions, such as analog front-end drift, ADC sampling artifacts, logic‑level timing collisions, or firmware handshake issues.
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Ability to assess and validate protection circuitry behavior under edge cases: current-limit foldback, soft-start anomalies, OV/UV trigger thresholds, fault‑latching logic.
Strong capability in identifying latent design defects (not just overt failures), including component tolerance stacking, thermal coupling issues, or layout-induced noise paths.
Knowledge of EMI/EMC design practices and grounding/shielding techniques.
Experience methodically troubleshooting and resolving issues and anomalies in accordance with root cause corrective action (RCCA) process.
Experience working cross-functionally with design engineering to refine schematics, update component selections, or propose design corrections based on board-level findings.
Excellent written and verbal communication skills with the ability to generate clear design documentation and review materials.
Ability to distill complex technical data into digestible presentation material for customers and executive leadership.