Assembly - Wire Bonder

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Our Wire Bonders are responsible for precision assembly of optoelectronic components in our cleanroom manufacturing environment.

This role supports production operations by performing wire bonding, assembly, inspection, and basic electrical testing of chips / die mounted to ceramic substrates and / or packages such as TO cans and LCCs.

The Wire Bonder works as part of a production team reporting to Operations, while collaborating closely with Engineering and Quality to meet product, process, and customer requirements.

This full-time, non-exempt role will report to the Director of Operations and is located at our Salem, NH Facility.

• Perform manual and semi automated wire bonding of chips and die to ceramic substrates and packages (e.g., TO can, LCC) using various gauges of wire
• Prep material. set up, and operate wire bond equipment per approved work instructions and travelers
• Handle optoelectronic devices using proper ESD, cleanliness, and contamination (FOD) control techniques
• Support engineering builds, process development, and continuous improvement activities, as needed Inspection, Testing & Quality
• Conduct visual inspection of assemblies under microscope to applicable MIL STD-883 workmanship criteria
• Perform basic electrical “go / no go” and at times more advanced testing using standard test fixtures and equipment
• Identify, document, and report nonconforming material or process issues
• Maintain accurate production records, travelers, and inspection results using our ERP system and shop floor interface Handling, Packaging & Workflow
• Package finished assemblies per work instructions and cleanliness requirements
• Maintain material traceability and proper part identification throughout the process
• Follow cleanroom protocols, including gowning, tool control, and housekeeping standards
• Work effectively within a team environment to meet production schedules and quality goals Qualifications & Skills