Advanced Packaging Technologist

Main Requirements and Qualifications

• Expertise in 2.5D/3D package architecture and advanced packaging technologies such as CoWoS, EMIB, SoIC, CoW, WoW, POP, etc.
• Working knowledge of package design, electrical signal integrity, power integrity, thermal, and thermomechanical principles, with a fundamental understanding of 2.5D/3D package challenges
• Experience with wafer level processes, package assembly processes, and substrate technology.
• Strong supply chain and quality management skills, including BOM management, procurement, logistics, and inventory
• Understanding of legacy packaging technologies, package failure mechanisms, and quick problem-solving skills
• Ability to develop and maintain strong relationships with key enablement partners and customers, ensuring smooth communication and alignment on project requirements, product quality, reliability, system, and operational needs
• Excellent communication skills
• 10-15% international travel required
• Salary range: $180,000 - $272,000
• Employee may be eligible for performance bonus, short and long term incentive programs. Actual total compensation will be dependent upon the individual's skills, experience and qualifications. In addition, MediaTek provides a variety of benefits including comprehensive health insurance coverage, life and disability insurance, savings plan, Company paid holidays, Paid time off (PTO), Parental leave, 401K and more.
• MediaTek is an Equal Opportunity Employer that is committed to inclusion and diversity to all, regardless of age, ancestry, color, disability (mental and physical), exercising the right to family care and medical leave, gender, gender expression, gender identity, genetic information, marital status, medical condition, military or veteran status, national origin, political affiliation, race, religious creed, sex (includes pregnancy, childbirth, breastfeeding and related medical conditions), and sexual orientation.
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