Advanced Packaging Reliability Engineer

Enjoy solving complex reliability challenges associated with cutting-edge HPC packages, including very large package form factors, high power, and high-speed chip integration.

Are excited to develop new reliability test methodologies, predictive models, and engineering solutions rather than relying solely on conventional industry practices.

Are motivated by pushing the limits of heterogeneous verfical integration (chip/package/system), high-current power delivery, advanced cooling, and large-scale package architectures.

Want to influence product architecture and design decisions through simulation-driven insights across chip, package, cooling, and system levels.

Enjoy learning broadly across semiconductor technologies, including chip architecture, power delivery, package integration, materials, cooling, and system-level interactions.

8+ years of industry experience & knowledge of semiconductor package reliability principles and failure mechanisms, including electromigration, solder-joint fatigue, interfacial delamination, dielectric cracking, via failure, warpage, creep, stress relaxation, and material degradation.

In-depth knowledge of advanced packaging architectures, including 2.5D and 3.5D integration, interposers, embedded bridges, chiplets, large package substrates, HBM integration, redistribution layers, and package-level power delivery.

Demonstrated experience leading package failure investigations, performing root-cause analysis, and implementing effective design, material, process, or manufacturing corrective actions.

Strong experience with thermal and mechanical finite-element modeling of packages, including temperature distribution, warpage, stress, strain, fatigue, and interfacial reliability.

Strong understanding of package-material behavior, including coefficient of thermal expansion, elasticity, viscoelasticity, plasticity, creep, adhesion, fracture toughness, thermal conductivity, and temperature-dependent properties.

Experience developing electromigration or interconnect lifetime models for solder joints, vias, redistribution layers, interposers, or package power-delivery structures.

Knowledge of package qualification methods, acceleration models, thermal cycling, power cycling, current-stress testing, and reliability lifetime extrapolation.

Familiarity with package failure-analysis techniques such as acoustic microscopy, X-ray imaging, cross-sectioning, scanning electron microscopy, and material characterization.

Experience supporting package-integrated voltage regulation, high-current power delivery, or high-transient-current AI and HPC products.

MS or PhD in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or a related technical field.

Strong communication, cross-functional collaboration, and technical leadership skills.

To comply with U.S. export control laws and regulations, candidates for this role may need to meet certain legal status requirements as provided in those laws and regulations.

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