Advanced Packaging Analyst

Build process flows for advanced packaging structures, including hybrid bonding, fan-out, 2.5D/3D integration, and interposer fabrication.

Measure critical dimensions such as TSVs, bump pitch, interposer features, and substrate layers.

Annotate images and write technical reports based on reverse engineering results.

Review and compare analysis results generation over generation, and foundry/OSAT to foundry/OSAT.

Write technical blogs and record video briefings on the state of the art in advanced packaging.

Work closely with other analysts and support broader project teams on technology trends, process/materials analysis, and documentation.

Answer customer questions on published reports.

Bachelors or Masters degree in a relevant field (Physics, Electrical Engineering, Materials Science, or related).

Strong knowledge of advanced packaging structures, materials, and integration schemes.

5+ years of industry experience in a foundry or OSAT in advanced packaging unit processes (hybrid bonding, TSV formation, fan-out, flip chip, interposer fabrication).

Experience interpreting results from analytical methods such as SEM, TEM, EDS, EELS, and FIB.

Knowledge of wafer probing and package final test processes and hardware will be considered an asset.

Familiarity with silicon photonics and co-packaged optics (e.g., optical engine assembly, PIC+EIC integration, optical coupling) are considered an asset but not required.

Strong analytical skills and the ability to work across multiple sources of information.

Excellent oral and written communication and presentation skills.

As part of the recruitment process for this position, you will be required to submit your latest citizenship and/or permanent residency information. This information will be used to comply with U.S. Export Control Laws and Regulations.

5 days in-office (Ottawa, ON).