Advanced Interconnect Lead, Quantum AI

Responsibilities

• Lead and manage our growing advanced interconnect technology team.
• Develop advanced integration and interconnect technologies for integrating cryogenic microwave devices and superconducting quantum components.
• Scope and purchase tools needed for development of integration technologies, including materials and processes, and determine the capabilities and limits of newly developed technologies.
• Collaborate with industrial and academic partners as a project technical lead for external technology development and implementation.
• Write documentation and transfer newly developed processes/technologies to in-house or external production.
• - Lead and manage our growing advanced interconnect technology team. - Develop advanced integration and interconnect technologies for integrating cryogenic microwave devices and superconducting quantum components. - Scope and purchase tools needed for development of integration technologies, including materials and processes, and determine the capabilities and limits of newly developed technologies. - Collaborate with industrial and academic partners as a project technical lead for external technology development and implementation. - Write documentation and transfer newly developed processes/technologies to in-house or external production.

Minimum qualifications:

Preferred qualifications:

Qualifications

• Minimum qualifications: - Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience. - 6 years of experience working with technology and process R&D in MEMS, PCB, or silicon technologies. - 3 years of experience in technical leadership. Preferred qualifications: - Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP). - Experience with a scripting or a programming language. - Experience with materials and integration technologies for electronics in extreme environments. Microwave engineering experience.